dtm Associates has performed hundreds of MCM and hybrid designs for commercial, industrial and military applications, including radiation-hardened and radiation-tolerant circuits. We have also designed and implemented many low-cost, high-volume hybrid product designs. We are completely familiar with industry-standard and cutting-edge design techniques, packaging materials and processing technologies for multi-component circuit assemblies:

Technology Selection and Implementation including Conventional Hybrids (Chip-and-Wire and Flip-Chip); Multi-Chip Modules (MCM-C, MCM-D and MCM-L); and Mixed Technology (Chip-and-Wire and SMT or Flip-Chip and SMT).

Design for Hybridization including Partitioning and Die Selection for Speed Performance, Low Noise and High Power; CAD Layout and Electrical/Thermal Simulation; Power Integrity and Distribution; Thin- and Thick-Film Technologies; and Signal Optimization Utilizing Multilayer and Power Plane Interconnection Stack Up.

Packaging Design and Materials Selection including Metal, Ceramic and Plastic Technologies; Hermetic and High Durability Construction Techniques; COTS Implementations; and Design for Reliability.

Material Selection for Performance including Metals, Alloys, Ceramics, Plastics, Assembly Joining Materials (Wire, Solder, Epoxy); and Materials for Mechanical and Thermal Compatibility and Performance.

dtm Associates has been involved in the microelectronics industry for over 25 years and we have maintained active membership in ISHM/IMAPS and the IEEE Microelectronics Society during this time.

Please let us design your next high performance product or take your existing product design and we will design a high performance packaging solution for your product's application.

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